01. Die Bonding

Secure silicon dies onto customized substrate surface per customer needs.

Capable of handling many special dies (e.g. MEMS dies) with proven processes

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02. Wire Bonding:

Make the fine-pitch wire connector between silicon dies to the outside world.

Capable of prototyping unique wiring path and special surfaces. 

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03. Optical Coupling

Align fiber to the designated position to ensure optimal performance.

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04. Mems Device Customization

Specilized in MEMS chip package, optical design and control integration, e.g. MEMS optical switch

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05. Device Assembly

Develop and implement optical module and equipment assembling process based on customized requirements.

Procure standard and customized components on behave of end customers.

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06. Equipment Testing

Measure electrical and optical parameters to verify the specification compliance. 

Conduct standard environmental tests per customer's specification.